Spesifikasi
Low-profile heat spreader design
Cost-efficient, high-performance DDR4 upgrade
Intel XMP-ready
Ready for AMD Ryzen™
Speeds up to 3733MHz1 and kit capacity up to 128GB
Plug N Play functionality at 2666MHz
CL(IDD) : 17 cycles
Row Cycle Time (tRCmin) : 45.75ns(min.)
Refresh to Active/Refresh : 350ns(min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 32ns(min.)
UL Rating : 94 V – 0
Operating Temperature : 0C to +85C
Storage Temperature : -55C to +100C
